发明名称 |
CMP COMPOSITION CONTAINING ZIRCONIA PARTICLES AND METHOD OF USE |
摘要 |
The invention provides a chemical-mechanical polishing composition containing zirconia particles, a modifying agent that adheres to the zirconia particles, an organic acid, and water, as well as a method of using such a polishing composition to polish substrates and a method of using a polishing composition comprising zirconia particles, an organic acid, an oxidizing agent, and water to polishing substrates containing metal and oxide-based dielectric materials. |
申请公布号 |
EP2852650(A4) |
申请公布日期 |
2016.02.24 |
申请号 |
EP20130793438 |
申请日期 |
2013.05.21 |
申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
JIN, WIECHANG;PARKER, JOHN;REMSEN, ELIZABETH |
分类号 |
C09K3/14;C09G1/02;C23F3/06;H01L21/3105;H01L21/321 |
主分类号 |
C09K3/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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