| 发明名称 |
SUBMOUNT-FREE LIGHT EMITTING DIODE (LED) COMPONENTS AND METHODS OF FABRICATING SAME |
| 摘要 |
Light emitting devices include a Light Emitting Diode (LED) chip having an anode contact and a cathode contact on a face thereof. A solder mask extends from the gap between the contacts onto one or both of the contacts. The LED chip may be mounted on a printed circuit board without an intervening submount. Related fabrication methods are also described. |
| 申请公布号 |
EP2954564(A4) |
申请公布日期 |
2016.02.17 |
| 申请号 |
EP20140749368 |
申请日期 |
2014.01.21 |
| 申请人 |
CREE, INC. |
发明人 |
HUSSELL, CHRISTOPHER P.;ANDREWS, PETER S.;REIHERZER, JESSE C. |
| 分类号 |
H01L33/00;H01L33/48;H01L33/50;H01L33/62 |
主分类号 |
H01L33/00 |
| 代理机构 |
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