TEMPERATURE SENSOR PACKAGE

摘要

Disclosed is a temperature sensor package. The temperature sensor package of the present invention comprises: a substrate; a thermopile located in an upper space of the substrate; an optical filter located in an upper part of the thermopile and selectively transmitting rays in the infrared band; an IC chip located in a lower space of the substrate and electrically connected to the thermopile by a via hole penetrating the substrate; and a support member formed in a lower part of the substrate.