Semiconductor device and manufacturing method therefor

摘要

A semiconductor device includes, a lead frame having a die pad and a plurality of leads each disposed around the die pad, a semiconductor element rested on the die pad of the lead frame, and bonding wires for electrically interconnecting the lead of the lead frame and the semiconductor element. The lead frame, the semiconductor element, and the bonding wires are sealed with a sealing resin section. The sealing resin section includes a central region provided over and around the semiconductor device, and a marginal region provided in the periphery of the central region. Thickness of the central region is greater than that of the marginal region.

主权项

1. A semiconductor device comprising:
a lead frame including a die pad and a plurality of leads each disposed around the die pad; a semiconductor element rested on the die pad of the lead frame; electroconductive portions for electrically interconnecting the lead of the lead frame and the semiconductor element; and a sealing resin section for sealing the lead frame, the semiconductor element, and electroconductive portions; wherein the sealing resin section includes a central region provided over and around the semiconductor device, and a marginal region provided in the periphery of the central region; and thickness of the central region is greater than that of the marginal region, wherein: each of the leads includes an external terminal exposed to the exterior, the external terminal is configured to be connected to an outside member of the semiconductor device; the external terminals of the leads are disposed on at least two round lines including an inner round line and an outer round line, the external terminals are arranged in a staggered layout; and the external terminals arranged on the inner round line have a smaller size than the external terminals arranged on the outer round line.