| 发明名称 |
Continuous loop cooling for an electronic device |
| 摘要 |
A continuous loop of thermally conductive material is provided with a first portion in frictional contact with a casing of an electronic device and a second portion located within a cooling region. The loop is advanced such that the first portion is located within the cooling region and the second portion is in frictional contact with the casing. |
| 申请公布号 |
US9265179(B2) |
申请公布日期 |
2016.02.16 |
| 申请号 |
US201314096653 |
申请日期 |
2013.12.04 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Elison Bret P.;Mann Phillip V.;Moore Arden L.;Sinha Arvind K. |
| 分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
Dobson Scott S.;Williams Robert |
| 主权项 |
1. An apparatus for cooling a direct access storage device, the apparatus comprising:
a thermally conductive material forming a continuous loop configured to be partially in frictional contact with a casing of the direct access storage device and partially located within a cooling region; and a driving device, the driving device configured to advance portions of the loop between the casing and the cooling region. |
| 地址 |
Armonk NY US |
