| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition for a printed wiring board capable of producing a laminate having a low coefficient of thermal expansion and excellent drilling processability, and to provide a prepreg, a laminate and a printed wiring board using the resin composition. <P>SOLUTION: This resin composition for the printed wiring board includes: a resin component; hydrous zinc molybdate (Zn<SB POS="POST">2</SB>MoO<SB POS="POST">4</SB>(OH)<SB POS="POST">2</SB>), wherein the atomic ratio of zinc to molybdenum is 2:1; and a metal oxide. The prepreg, the laminate and the printed wiring board obtained using the resin composition are also provided. <P>COPYRIGHT: (C)2013,JPO&INPIT |
