发明名称 リードフレーム配線体、モジュール及びその製造方法
摘要 <P>PROBLEM TO BE SOLVED: To maintain the relative position of a wiring pattern 22 or a mounting part 23 even if a tie bar is removed. <P>SOLUTION: A lead frame wiring body comprises a circuit board 4 which is formed of a plurality of wiring patterns 22 forming a signal line and a plurality of mounting parts 23 for mounting products to be mounted; a sheet-like lead frame 20A including a frame 21 provided to surround the circuit board 4, and tie bars 24 connecting the wiring patterns 22, the mounting parts 23 and the frame 21; and a frame side adhesive body pasted to the lead frame 20A to cover the lead frame 20A. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5861258(B2) 申请公布日期 2016.02.16
申请号 JP20110035937 申请日期 2011.02.22
申请人 日本電気株式会社 发明人 馬場 直人;田子 雅基
分类号 H01L23/50;H01L23/12;H01L23/36;H01L23/48;H01L25/07;H01L25/18 主分类号 H01L23/50
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