MULTI-CHIP SEMICONDUCTOR APPARATUS

摘要

A multi-chip semiconductor apparatus includes a plurality of semiconductor chips stacked and packaged therein, wherein each of the semiconductor chips includes: a through-silicon via (TSV) formed through the semiconductor chip; a probe pad exposed to an outside of the semiconductor chip so as to enable a probing test; a bump pad exposed to the outside of the semiconductor chip and electrically connected to the TSV; and a conductive layer electrically connecting the probe pad and the bump pad inside the semiconductor chip.

主权项

1. A multi-chip semiconductor apparatus comprising a plurality of semiconductor chips stacked and packaged therein,
wherein each of the semiconductor chips comprises: a plurality of through-silicon vias (TSVs) formed through the semiconductor chip; a probe pad exposed to an outside of the semiconductor chip accessible by a probing test; a plurality of bump pads exposed to the outside of the semiconductor chip and electrically connected to the respective TSVs; and one or more conductive layers electrically connecting the probe pad to the respective bump pads inside the semiconductor chip.