| 摘要 |
A mounting device (100) for mounting electronic components, wherein the mounting device (100) comprises a carrier structure, in particular an electrically conductive structure (102), and a sliding structure (104) being at least partially embedded within the carrier structure, in particular the electrically conductive structure (102), and being made of a material which has non-adhesive properties on material of the carrier structure, in particular the electrically conductive structure (102), so that portions of the carrier structure, in particular the electrically conductive structure (102), are capable of sliding on the sliding structure (104) to thereby at least partially equilibrate mechanical stress within the mounting device (100). |
