| 摘要 |
Disclosed are a light emitting device, a method of fabricating the same, a light emitting device package, and a lighting system. The light emitting device may include a substrate (105), a first conductive semiconductor layer (112) on the substrate, an active layer (114) on the first conductive semiconductor layer, a second conductive semiconductor layer (116) on the active layer, an ohmic layer (120) on the second conductive semiconductor layer, an insulating layer (130) on the ohmic layer, a first branch electrode (140) electrically connected with the first conductive semiconductor layer, a first pad electrode (142) connected with the first branch electrode for electrical connection with the first conductive semiconductor layer, a second pad electrode (152) in contact with the ohmic layer through the insulating layer, a second branch electrode (150) connected with the second pad electrode on the insulating layer, and a second through electrode (154) passing through the insulating layer to connect the second branch electrode with the ohmic layer. |
