发明名称 |
Electronic Device Including a Buffer Layer Comprising A Functionalized Metal Nanoparticle |
摘要 |
Disclosed herein is a functionalized metal nanoparticle, a buffer layer including the functionalized metal nanoparticle, and an electronic device including the buffer layer. The buffer layer including the functionalized metal nanoparticle according to example embodiments may improve the injection of electrons or holes and the charge mobility between layers in the electronic device, may form ohmic contacts, and may improve the selectivity between electrodes and the buffer layer at the time of forming the buffer layer on the electrodes, thereby improving the efficiency of the electronic device. |
申请公布号 |
EP1997814(B1) |
申请公布日期 |
2016.02.10 |
申请号 |
EP20080155875 |
申请日期 |
2008.05.08 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
MOON, HYUN SIK;PARK, JONG JIN;KOO, BON WON;HAHN, JUNG SEOK;KIM, DO HWAN |
分类号 |
C07D271/113;C07F7/18;H01L51/00;H01L51/50 |
主分类号 |
C07D271/113 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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