Embedded electronic device and method for manufacturing an embedded electronic device

摘要

An embedded electronic device and a method for manufacturing the same wherein the embedded electronic device is composed of a printed circuit board, having a top surface and a bottom surface, a plurality of circuit components attached to the top surface of the printed circuit board having a plurality of standoffs on the bottom surface of the printed circuit board, a bottom overlay attached to the bottom surface of the printed circuit board, a top overlay positioned above the top surface of the printed circuit board and a core layer positioned between the top surface of the printed circuit board and the top overlay.

主权项

1. A method for manufacturing an embedded electronic device, comprising:
providing a circuit board having a top surface and a bottom surface, a plurality of circuit components being affixed onto the top surface of the circuit board such that the plurality of circuit components are in direct electrical contact with the top surface of the circuit board; affixing the bottom surface of the circuit board to a bottom overlay using an adhesive so that the bottom surface of the circuit board is directly and uniformly attached to the bottom overlay over their entire common surfaces; loading the circuit board and bottom overlay into an injection molding apparatus; loading a top overlay positioned above a top surface of the circuit board into the injection molding apparatus; and injecting a thermosetting polymeric material between the top surface of the circuit board, the plurality of circuit components, and the top overlay, which thermosetting polymeric material is in physical contact with the plurality of circuit components.