Bond ply for adhesive bonding of composites and associated systems and methods

摘要

A method of forming a composite material includes providing an uncured substrate. The method further includes applying a bond ply to the substrate and a peel ply to the bond ply. In some embodiments, the bond ply comprises a fiber veil, such as a glass fiber veil. The method further includes curing the substrate and removing the bond ply and peel ply from the cured substrate, thereby exposing an active surface on the substrate. Removing the bond ply and peel ply can create fractures in the active surface that increase the roughness and bondability of the active surface. In several embodiments, the composite materials described herein can be compatible with a wide range of adhesives, including room temperature adhesives.

主权项

1. A method of forming a composite material, the method comprising:
providing an uncured substrate; applying a bond ply to the substrate, the bond ply comprising a fiber veil or fiber mat of randomly-oriented fibers; applying a peel ply to the bond ply, wherein the fibers in the bond ply have a greater tensile strength than fibers in the peel ply; curing the substrate; removing the bond ply and the peel ply from the substrate, thereby exposing an active surface of the substrate, wherein the active surface comprises a material; and fracturing the active surface material.