发明名称 多数個取り配線基板の製造方法
摘要 <P>PROBLEM TO BE SOLVED: To provide a multi-piece wiring board which reduces misalignment of a formation position of a dividing groove when the dividing groove is formed. <P>SOLUTION: A multi-piece wiring board manufacturing method comprises a step of forming a plurality of recesses 3 in a ceramic green sheet 1 by applying pressure on the heated ceramic green sheet 1 and forming a plurality of dividing grooves 6 by the ceramic green sheet 1 pushed aside and transferred when the recesses 3 are formed. Because each of the dividing grooves 6 is formed in a central region between the recesses 3, misalignment of the dividing groove 6 can be reduced. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5855928(B2) 申请公布日期 2016.02.09
申请号 JP20110275876 申请日期 2011.12.16
申请人 京セラ株式会社 发明人 犬山 重俊
分类号 H05K3/00 主分类号 H05K3/00
代理机构 代理人
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