发明名称 CIRCUIT SUBSTRATE, ELECTRONIC DEVICE AND MOUNTING STRUCTURE
摘要 A technique is provided that can reduce noise while cutting costs. This circuit substrate is provided with a substrate, a circuit provided on the substrate, a connector mounted on the substrate, and a shield. The shield is provided between the circuit and the connector so as to surround at least the connector, and electrically is directly connected to a conductive housing unit.
申请公布号 WO2016017024(A1) 申请公布日期 2016.02.04
申请号 WO2014JP70312 申请日期 2014.08.01
申请人 HITACHI, LTD. 发明人 KOMIYA, YASUMARO
分类号 H05K1/02;H05K9/00 主分类号 H05K1/02
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