| 主权项 |
1. A method of manufacturing a semiconductor device, comprising the steps of:
(a) providing a substrate having a first main surface and a second main surface on the side opposite to the first main surface and forming a plurality of semiconductor elements over the first main surface of the substrate to form a semiconductor wafer; (b) providing an annular ring to which an adhesive tape has been attached; (c) attaching the semiconductor wafer onto the adhesive tape so that the the second main surface of the semiconductor wafer faces the adhesion surface of the adhesive tape located in the ring; (d) dicing the semiconductor wafer into a plurality of semiconductor chips to form a sawn wafer in which the plurality of semiconductor chips are retained by the ring while being attached to the adhesive tape; (e) after the step (d), housing the sawn wafer in a shipping case having a first case portion that covers a first surface of the sawn wafer to which the semiconductor chips have been attached and a second case portion of the sawn wafer that cover a second surface on the side opposite to the first surface and thereby fixing the ring; (f) after the step (e), housing the shipping case in a shipping bag; and (g) after the step (f), sucking a gas from the shipping bag to reduce a pressure in the shipping case, wherein the first case portion has, in the step (e), a first recess portion that covers the semiconductor chips and a first ventilation route communicated with the first recess portion and coupled to an external space of the shipping case; wherein the second case portion has, in the step (e), a second recess portion that covers the second surface of the sawn wafer; and wherein in the step (g), a gas is discharged from the shipping case via the first ventilation route. |
