| 发明名称 |
METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC COMPONENT MOUNTING DEVICE |
| 摘要 |
An electronic component mounting device, includes a stage in which a plurality of stage portions are defined, a first heater provided in the plurality of stage portions respectively, and the first heater which can be controlled independently, a mounting head arranged over the stage, and a second heater provided in the mounting head. |
| 申请公布号 |
US2016035694(A1) |
申请公布日期 |
2016.02.04 |
| 申请号 |
US201514883111 |
申请日期 |
2015.10.14 |
| 申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
HIGASHIZAWA Yoshitada;KOBAYASHI Kosuke;HATAYAMA Yukinori |
| 分类号 |
H01L23/00;B23K1/00;B23K1/008 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
Nagano-shi JP |
