| 摘要 |
A package 10 for housing electronic components, comprising an insulating substrate 1 having a mounting area 2a for electronic components, on an upper surface 2 thereof, and a first cut-out section 5 and a second cut-out section 6, in a lower surface 3 thereof. The first cut-out section 5 cuts into a lower section of a side surface 4 of the insulating substrate 1 and is cut out from the lower section of the side surface 4 to the lower surface 3. A plurality of wiring conductors 7 are formed in the first cut-out section 5, that penetrate the insulating substrate 1 and are led out to the upper surface 2 of the insulating substrate 1 from the lower surface 3 of the insulating substrate 1 and via an inner wall surface of the first cut-out section 5. The second cut-out section 6 is provided between the wiring conductors 7, from the inner wall surface of the first cut-out section 5 across to the lower surface 3. The wiring conductors 7 can be closely arranged as a result of the provision of the second cut-out section 6. |
