Surface emitting semiconductor laser, surface emitting semiconductor laser array, surface emitting semiconductor laser device, optical transmission device, information processing apparatus, and method of producing surface emitting semiconductor laser

摘要

A surface emitting semiconductor laser includes a substrate, a first conductivity-type first semiconductor multilayer reflector, an active layer, a semiconductor layer, a second conductivity-type second semiconductor multilayer reflector that includes a current confinement layer, and a heat dissipating metal member. At least the first semiconductor multilayer reflector, the active layer, the semiconductor layer, and the second semiconductor multilayer reflector are stacked in this order on the substrate. A columnar structure having a top portion, a side surface, and a bottom portion is formed from the second semiconductor multilayer reflector to the semiconductor layer. The heat dissipating metal member is connected to the semiconductor layer exposed at the bottom portion of the columnar structure.

主权项

1. A surface emitting semiconductor laser comprising:
a substrate; a first conductivity-type first semiconductor multilayer reflector; an active layer; a semiconductor layer; a second conductivity-type second semiconductor multilayer reflector that includes a current confinement layer; a heat dissipating metal member, wherein at least the first semiconductor multilayer reflector, the active layer, the semiconductor layer, and the second semiconductor multilayer reflector are stacked one on top of another in this order on the substrate, wherein a columnar structure having a top portion, a side surface, and a bottom portion is formed so as to extend from the second semiconductor multilayer reflector to the semiconductor layer, and wherein the heat dissipating metal member is connected to the semiconductor layer exposed at the bottom portion of the columnar structure; and a first electrode formed at a top portion of the columnar structure; and a second electrode formed at a rear surface of the substrate.