Cooling device with liquid for electronic cards, in particular for high performance processing units

摘要

Cooling device with liquid for electronic cards, in particular for high-performance processing units, comprising at least a hydraulic circuit in which a heat-carrying fluid flows in order to extract the heat produced by electronic components and/or hot spots present on an associated electronic card. The device comprises a cooling plate mechanically coupled to the electronic card so as to be inserted in a containing rack of the processing unit. The plate has a heat extraction surface facing and partly in contact, or at least in close proximity, with the electronic components and/or the hot spots. The hydraulic circuit is made in the thickness of the plate and has a geometric grid development, along which a plurality of hydraulic sub-circuits are disposed and switching means to define desired paths. The plate has sliding guide means able to cooperate with corresponding alignment means of the containing rack.

主权项

1. A cooling device for a plurality of electronic cards of a processing units, comprising at least a hydraulic circuit in which a heat-carrying fluid flows in order to extract heat produced by electronic components and/or by hot spots present on a printed circuit board of at least one electronic card that is associated with the cooling device, the cooling device comprising a cooling plate made of heat conductive material, and provided with a mechanical coupling means to said electronic card so as to be inserted together as a combined plate/card in a containing rack for the plurality of electronic cards of said processing unit, wherein said cooling plate has at least a heat extraction surface directly facing toward the printed circuit board on which said electronic components and/or said hot spots are present and at least partly in contact with, or at least in close reciprocal contact to said electronic components and/or said hot spots, said heat extraction surface having protruding dissipation portions, configured to be disposed at the position of the electronic components and/or the hot spots of said electronic card wherein said heat extraction surface is able to contact said electronic components and/or hotspots, said hydraulic circuit being made in a thickness of said cooling plate and comprising a plurality of hydraulic sub-circuits in a grid structure which are selectively activated by a switching/deflector means including plugs disposed along at least part of said hydraulic sub-circuits in order to define desired paths which can be selectively varied by switching a flow of the heat-carrying fluid in correspondence with the electronic components and/or with the hot spots of said electronic card, and wherein said cooling plate has a sliding guide means able to cooperate with a corresponding alignment means of the containing rack in order to insert/extract the combined plate/card into/from the containing rack.