| 摘要 |
PROBLEM TO BE SOLVED: To suppress impact of a stress from an electrode on the characteristics of an element.SOLUTION: A design device 100 determines whether or not an element tt provided on the layer of a designed circuit receives a stress due to an electrode provided on a layer different from the layer of an element of the designed circuit, by the distance between the element tt and a bump 111. When a determination is made that the element tt receives a stress due to the bump 111, the design device 100 generates layout data indicating provision of a stress film, where the direction of internal stress is opposite from the direction of stress due to the bump 111. The stress film is provided at a position overlapping a part of the element tt receiving the stress due to the bump 111, in a layer between the layer of the element tt of designed circuit and the layer of the electrode.SELECTED DRAWING: Figure 1 |
