发明名称 ELECTROLESS PLATING PRETREATMENT LIQUID, AND ELECTROLESS PLATING METHOD USING THE SOLUTION
摘要 PROBLEM TO BE SOLVED: To provide an electroless plating pretreatment liquid capable of being stably used for a long term even within a wide range of pH, and an electroless plating method using the pretreatment liquid.SOLUTION: A coating film for a plating object is formed by using a neutral sol solution composed of a tetravalent tin compound, an aqueous solution of palladium complex, and an aqueous solution of silver complex, solely or in a mixed solution. After this, a reduction treatment is performed to perform a surface activation and an electroless plating. The solution to be used herein can be stably used for one month or longer even in a neutral region.SELECTED DRAWING: None
申请公布号 JP2016017217(A) 申请公布日期 2016.02.01
申请号 JP20140141926 申请日期 2014.07.10
申请人 NAGANO PREFECTURE 发明人 NAGATANI SATOSHI;MIZUSAKI HIDEAKI
分类号 C23C18/28;C23C18/30;C23C18/36;C23C18/40;C23C18/44 主分类号 C23C18/28
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