PREPREG WITH PRIMER LAYER FOR PLATING PROCESS, MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREFOR EACH USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a prepreg with a primer layer for plating process that can cope with a semi-additive method for achieving low thermal expansion, high elastic modulus and micro wiring and to provide a printed wiring board and a method for manufacturing the same each using the prepreg.SOLUTION: The prepreg with a primer layer for plating process is a prepreg with a primer layer laminated on one surface of the prepreg and is produced by laminating a film with a primer layer formed of a thermosetting resin composition including (A) an epoxy resin, (B) a polymer component, (C) an epoxy resin curing agent and (D) a curing accelerator in a thickness of 10 μm or less on the film on one surface of the prepreg.SELECTED DRAWING: None