| 摘要 |
Provided are a semiconductor device forming a solder fillet on a cross section of a lead portion via the upper surface of the lead portion exposed from an encapsulation resin portion when the semiconductor device is bonded to a circuit board such as a printed board by adhesive of solder without a plating layer on the cross section of the lead portion and a manufacturing method thereof. A resin-encapsulated semiconductor device includes a semiconductor element mounted on a die pad portion, a plurality of lead portions with end portions thereof opposed to the die pad portion, and a thin metal wire for connecting an electrode of the semiconductor element and the lead portion. Those members are partially encapsulated by a resin. A bottom surface part of the die pad portion and a lead bottom surface part, an outer surface part, and an upper end part of the lead portion are exposed from the encapsulation resin. After a cutout part devoid of the encapsulation resin is formed above a lead upper end part, a plating layer is formed on the lead bottom surface part and the lead upper end part. |
