发明名称 SEMICONDUCTOR DEVICES AND STRUCTURES
摘要 Methods of forming semiconductor devices, memory cells, and arrays of memory cells include forming a liner on a conductive material and exposing the liner to a radical oxidation process to densify the liner. The densified liner may protect the conductive material from substantial degradation or damage during a subsequent patterning process. A semiconductor device structure, according to embodiments of the disclosure, includes features extending from a substrate and spaced by a trench exposing a portion of a substrate. A liner is disposed on sidewalls of a region of at least one conductive material in each feature. A semiconductor device, according to embodiments of the disclosure, includes memory cells, each comprising a control gate region and a capping region with substantially aligning sidewalls and a charge structure under the control gate region.
申请公布号 US2016027882(A1) 申请公布日期 2016.01.28
申请号 US201514875493 申请日期 2015.10.05
申请人 Micron Technology, Inc. 发明人 Larsen Christopher J.;Daycock David A.;Shrotri Kunal
分类号 H01L29/423;H01L29/788;H01L29/06;H01L27/115 主分类号 H01L29/423
代理机构 代理人
主权项 1. A semiconductor device structure, comprising: a plurality of features extending from a substrate, neighboring features of the plurality spaced from one another by a trench exposing a portion of the substrate, at least one feature of the plurality comprising: a region of at least one conductive material over the substrate; anda liner on sidewalk of the region of the at least one conductive material.
地址 Boise ID US
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