发明名称 |
SEMICONDUCTOR DEVICES AND STRUCTURES |
摘要 |
Methods of forming semiconductor devices, memory cells, and arrays of memory cells include forming a liner on a conductive material and exposing the liner to a radical oxidation process to densify the liner. The densified liner may protect the conductive material from substantial degradation or damage during a subsequent patterning process. A semiconductor device structure, according to embodiments of the disclosure, includes features extending from a substrate and spaced by a trench exposing a portion of a substrate. A liner is disposed on sidewalls of a region of at least one conductive material in each feature. A semiconductor device, according to embodiments of the disclosure, includes memory cells, each comprising a control gate region and a capping region with substantially aligning sidewalls and a charge structure under the control gate region. |
申请公布号 |
US2016027882(A1) |
申请公布日期 |
2016.01.28 |
申请号 |
US201514875493 |
申请日期 |
2015.10.05 |
申请人 |
Micron Technology, Inc. |
发明人 |
Larsen Christopher J.;Daycock David A.;Shrotri Kunal |
分类号 |
H01L29/423;H01L29/788;H01L29/06;H01L27/115 |
主分类号 |
H01L29/423 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor device structure, comprising:
a plurality of features extending from a substrate, neighboring features of the plurality spaced from one another by a trench exposing a portion of the substrate, at least one feature of the plurality comprising:
a region of at least one conductive material over the substrate; anda liner on sidewalk of the region of the at least one conductive material. |
地址 |
Boise ID US |