PACKAGE-IN-PACKAGE SEMICONDUCTOR SENSOR DEVICE

摘要

A semiconductor sensor device includes a device substrate, a micro-controller unit (MCU) die attached to the substrate, and a packaged pressure sensor having a sensor substrate and a pressure sensor die. The sensor substrate has a front side with the pressure sensor die attached to it, a back side, and an opening from the front side to the back side. A molding compound encapsulates the MCU die, the device substrate, and the packaged pressure sensor. A back side of the sensor substrate and the opening in the sensor substrate are exposed on an outer surface of the molding compound.

主权项

1. A method for assembling a semiconductor sensor device, the method comprising:
a) providing a sensor substrate having a front side and a back side; b) forming an opening through the sensor substrate; c) flip-chip bonding a pressure sensor die to the front side of the sensor substrate; d) filling a region between the pressure sensor die and the sensor substrate with a pressure-sensitive gel; and e) encapsulating the sensor substrate, the pressure sensor die, and the pressure-sensitive gel with a molding compound, leaving the back side of the sensor substrate exposed.