发明名称 COPPER ALLOY MATERIAL, METHOD FOR PRODUCING COPPER ALLOY MATERIAL, LEAD FRAME AND CONNECTOR
摘要 PROBLEM TO BE SOLVED: To provide: a copper alloy material improved in conductivity, strength and stress relaxation resistance in good balance; a method for producing a copper alloy material; a lead frame; and a connector.SOLUTION: There is provided a copper alloy material which comprises 0.2 mass% or more and 0.6% or less of iron, 0.02 mass% or more and 0.06 mass% or less of nickel, 0.07 mass% or more and 0.3 mass% or less of phosphorus, 0.01 mass% or more and 0.2 mass% or less of magnesium, 0.001 mass% or more and 0.05 mass% or less in total of one or more elements selected from tin, silver, manganese, chromium and titanium and the balance of copper and inevitable impurities and has conductivity of 70% IACS or more, a 0.2% yield strength of 500 MPa or more and a stress relaxation rate after heating at 150°C for 1000 hours of 30% or less.
申请公布号 JP2016014165(A) 申请公布日期 2016.01.28
申请号 JP20140135583 申请日期 2014.07.01
申请人 SH COPPER PRODUCTS CORP 发明人 YAMAMOTO YOSHINORI;SEKI SOSHI
分类号 C22C9/00;C22F1/08;H01B1/02;H01B13/00 主分类号 C22C9/00
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