| 发明名称 |
CONDUCTIVE FILM-FORMING COMPOSITION AND CONDUCTIVE FILM PRODUCING METHOD |
| 摘要 |
In a conductive film-forming composition including copper oxide particles, water and a dispersant selected from the group consisting of a water-soluble polymer and a surfactant, the copper oxide particles have a volume average secondary particle size of 20 to 240 nm, and the copper oxide particles are contained in an amount of 10 to 70 wt % with respect to a total weight of the conductive film-forming composition. |
| 申请公布号 |
US2016024316(A1) |
申请公布日期 |
2016.01.28 |
| 申请号 |
US201514807654 |
申请日期 |
2015.07.23 |
| 申请人 |
FUJIFILM CORPORATION |
发明人 |
SASADA Misato;HAYATA Yuuichi;HONGO Yushi;KARIYA Toshihiro |
| 分类号 |
C09D5/24;H01B13/00 |
主分类号 |
C09D5/24 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A conductive film-forming composition comprising copper oxide particles, water and a dispersant selected from the group consisting of a water-soluble polymer and a surfactant,
wherein the copper oxide particles have a volume average secondary particle size of 20 to 240 nm, and wherein the copper oxide particles are contained in an amount of 10 to 70 wt % with respect to a total weight of the conductive film-forming composition. |
| 地址 |
Tokyo JP |
