Electronic Component, Manufacturing Method for Electronic Component, Electronic Apparatus, and Moving Object

摘要

In order to prevent deformation or damage of a base of a lead terminal by alleviating stress which concentrates on the base of the lead terminal protruding from an electronic component main body, the lead terminal includes a connection pad connected to a connection terminal provided on a first substrate, and a lead portion extending from the connection pad, and the lead terminal also includes a first surface connected to the connection terminal, a second surface that is a rear surface thereof, and a third surface that is a side surface, and in which the lead portion includes a first bent section and a third bent section that are bent in a direction intersecting the first surface or the second surface, a second bent section that is bent in a direction intersecting the third surface between the first bent section and the third bent section.

主权项

1. An electronic component comprising:
a substrate that is provided with a connection terminal; and a lead terminal that includes a first surface, a second surface which is a rear surface of the first surface, and a third surface which connects the first surface to the second surface, and includes a connection pad, a lead portion connected to the connection pad, and a lead end portion provided at the lead portion on an opposite side to the connection pad, wherein the first surface of the connection pad is connected to the connection terminal via a joining member, and wherein the lead portion includes
a first bent section that is bent in a direction intersecting the first surface or the second surface;a second bent section that is bent in a direction intersecting the third surface between the first bent section and the lead end portion; anda third bent section that is bent in a direction intersecting the first surface or the second surface between the second bent section and the lead end portion.