Methods And Structures For Thin-Film Encapsulation And Co-Integration Of Same With Microelectronic Devices and Microelectromechanical Systems (MEMS)

摘要

Methods and structures that may be implemented in one example to co-integrate processes for thin-film encapsulation and formation of microelectronic devices and microelectromechanical systems (MEMS) such as sensors and actuators. For example, structures having varying characteristics may be fabricated using the same basic process flow by selecting among different process options or modules for use with the basic process flow in order to create the desired structure/s. Various process flow sequences as well as a variety of device design structures may be advantageously enabled by the various disclosed process flow sequences.

主权项

1. A method of forming a microshell structure, comprising:
forming a first sacrificial layer over a MEMS region and an underlying substrate, and removing a part of the first sacrificial layer to leave one or more remaining portions of the first sacrificial layer; forming a second sacrificial layer over the remaining portions of the first sacrificial layer, and removing a part of the second sacrificial layer to leave one or more remaining portions of the second sacrificial layer over at least a part of the remaining portions of the first sacrificial layer; forming an upper microshell layer over the remaining portions of the first and second sacrificial layers; creating one or more upper release holes in the upper microshell layer; removing at least a part of the remaining portions of the first and/or second sacrificial layers through the upper release holes to form one or more open cavities or open areas under the upper microshell layer; and forming a sealing layer on the upper microshell layer to seal the upper release holes in the upper microshell layer.