发明名称 半導体製造システム
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing system including an electron beam lithography device, capable of performing high-quality pattern drawing free from degradation of a drawing pattern due to step displacement or the like, without stopping electron beam lithography upon occurrence of an earthquake. <P>SOLUTION: A semiconductor manufacturing system comprises: a receiving device for receiving earthquake information; and an electron beam lithography device. The receiving device includes: a receiving section for receiving emergency earthquake information; a calculation section for calculating seismic intensity and an arrival time; and a signal output section for, only when predicting and detecting principal motion equal to or greater than certain seismic intensity, outputting a signal for instructing earthquake countermeasures to the electron beam lithography device. The electron beam lithography device comprises: a signal receiving section for receiving the output signal; an earthquake countermeasure execution section for suspending an operation of the device after completing a predetermined operation on the basis of the output signal before the principal motion equal to or greater than the certain seismic intensity arrives; and a return execution section for restarting the operation after a certain time has passed. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5849505(B2) 申请公布日期 2016.01.27
申请号 JP20110171450 申请日期 2011.08.05
申请人 大日本印刷株式会社 发明人 小澤 英則;古川 智彦
分类号 H01L21/02;H01L21/027 主分类号 H01L21/02
代理机构 代理人
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