发明名称 Method of manufacturing light-absorbing layer having semiconductor nanoparticles and method of manufacturing semiconductor device having the same light-absorbing layer
摘要 An exemplary method of manufacturing a light-absorbing layer and a method of manufacturing a semiconductor device including the same light-absorbing layer are provided. The exemplary method includes: forming a nanoparticles film by applying a semiconductor nanoparticles solution on a substrate; thermally treating the nanoparticles film at least one time to cause adhesion among the nanoparticles; and forming a light-absorbing layer by applying a light-absorbing solution on the nanoparticles film.
申请公布号 US9246116(B2) 申请公布日期 2016.01.26
申请号 US201414149529 申请日期 2014.01.07
申请人 SNU R&DB FOUNDATION 发明人 Lee Changhee;Char Kookheon;Lee Seonghoon;Lee Donggu;Lim Jaehoon;Song Jiyun
分类号 H01L21/00;H01L51/42;B82Y40/00 主分类号 H01L21/00
代理机构 Harness, Dickey & Pierce, P.L.C. 代理人 Harness, Dickey & Pierce, P.L.C.
主权项 1. A method of manufacturing a light-absorbing layer comprising semiconductor nanoparticles, the method comprising: forming a nanoparticles film by applying a solution of semiconductor nanoparticles on a substrate; thermally treating the nanoparticles film at least one time to cause adhesion among the nanoparticles; surface-treating the nanoparticles film in order to reduce a surface state of the nanoparticles film by (i) coating the nanoparticles film with a solution containing a ligand for surface treatment and (ii) drying the coated nanoparticles film; and forming a light-absorbing layer by applying a light-absorbing solution on the nanoparticles film, wherein each of the semiconductor nanoparticles has at least one of a tetrapod shape and a hyper-branched shape, wherein the method further comprises, before forming the nanoparticles film: dispersing the semiconductor nanoparticles in a solvent; and modifying surfaces of the semiconductor nanoparticles to an L-type ligand.
地址 Seoul KR