| 发明名称 | Module and electronic apparatus | ||
| 摘要 | A module includes a sensor device, a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable, a supporting member having fixing faces, wherein the sensor device is mounted on at least one of the mounting faces, each of the mounting faces is disposed along each of the fixing faces, and the sensor device is disposed on the supporting member side. | ||
| 申请公布号 | US9243909(B2) | 申请公布日期 | 2016.01.26 |
| 申请号 | US201213478619 | 申请日期 | 2012.05.23 |
| 申请人 | Seiko Epson Corporation | 发明人 | Sakuma Masayasu;Kobayashi Yoshihiro;Kitamura Shojiro;Chino Taketo;Ogami Michiharu |
| 分类号 | G01P1/02;G01C19/5783;G01D11/24;G01P15/18 | 主分类号 | G01P1/02 |
| 代理机构 | Harness, Dickey & Pierce, P.L.C. | 代理人 | Harness, Dickey & Pierce, P.L.C. |
| 主权项 | 1. A module comprising: a sensor device; a mounting substrate that has a plurality of mounting faces, a portion between the mounting faces adjacent to each other being foldable to manipulate an angle between the mounting faces; and a supporting member having a plurality of fixing faces, wherein at least one of the plurality of fixing faces is provided with a clearance portion, the sensor device and one of the plurality of fixing faces are bonded directly to each other, the sensor device is disposed on a supporting member side of the mounting faces and at least a part of the sensor device is accommodated in the clearance portion, each of the mounting faces is disposed along each of the fixing faces, and the mounting substrate surrounds an exterior of the supporting member. | ||
| 地址 | JP | ||