PREPARATION COMPONENT SET, PREPARATION, METHOD FOR MANUFACTURING PREPARATION, IMAGE PHOTOGRAPHING DEVICE, AND IMAGE PHOTOGRAPHING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a preparation component set for imaging of a CIS(Contact Image Sensing) system and a method for manufacturing a preparation.SOLUTION: The preparation includes an image sensor B01, a package 12 which supports the image sensor, so that a front surface comes into contact with or faces the rear surface of the image sensor and includes a plurality of terminals 13 electrically connected to the image sensor, a transparent plate which is arranged so as to face the surface of the image sensor through an object, and an encapsulant which fixes the object between the surface of the image sensor and the transparent plate. The image sensor includes a substrate 400 which includes a plurality of holes penetrating from a front surface side to a rear surface side, a wiring layer 402 which is provided on the front surface side of the substrate, and a plurality of conductors 420 which are a plurality of conductors provided in the plurality of holes of the substrate respectively and electrically connect the wiring layer to the plurality of terminals of the package.