| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring circuit board reduced in the loss of an electric signal even in a high frequency band, and a method of manufacturing the wiring circuit board.SOLUTION: A wiring pattern W1 for writing is formed on an insulating layer 41. A coating layer 43 is formed on the insulating layer 41 so as to cover the wiring pattern W1 for writing in a state where the coating layer is directly in contact with at least a first part of the surface of the wiring pattern W1 for writing. A connection terminal 21 is formed on the insulating layer 41 so as to be electrically connected to the wiring pattern W1 for writing and exposed from the coating layer 43. |
