| 发明名称 |
METHOD FOR FABRICATING AN INTERPOSER |
| 摘要 |
A method for fabricating an interposer is provided, which includes the steps of: providing a substrate body having a chip mounting side and an opposite external connection side and a plurality of conductive through holes communicating the chip mounting side and the external connection side, wherein the chip mounting side of the substrate body is covered with a protection layer; performing a singulation process on the external connection side of the substrate body; bonding the substrate body to a carrier via the external connection side thereof; removing the protection layer; and removing the carrier to form a plurality of interposers, thereby simplifying the fabrication process and improving the product yield. |
| 申请公布号 |
US2016020190(A1) |
申请公布日期 |
2016.01.21 |
| 申请号 |
US201514744464 |
申请日期 |
2015.06.19 |
| 申请人 |
SILICONWARE PRECISION INDUSTRIES CO., LTD. |
发明人 |
Wu Wen-Kuang;Yuan Tsung-Te;Lu Chun-Hung |
| 分类号 |
H01L23/00;H01L21/78 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for fabricating an interposer, comprising the steps of:
providing a substrate body having a chip mounting side and an opposite external connection side and a plurality of conductive through holes communicating the chip mounting side and the external connection side, wherein the chip mounting side of the substrate body is covered with a protection layer; performing a singulation process on the external connection side of the substrate body; bonding the substrate body to a carrier via the external connection side thereof; removing the protection layer; and removing the carrier to form a plurality of interposers. |
| 地址 |
Taichung TW |
