发明名称 |
COPPER FOIL FOR WIRING BOARD AND WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide copper foil for wiring boards which combines resin adhesion desirable for wiring boards and visibility after formation of a circuit pattern.SOLUTION: In copper foil for wiring boards, the surface of electrolytic copper to be adhered with a resin has a diffuse reflectance (R) at the 600-nm wavelength of 5-50% and a color saturation (C) of 50 or smaller. In the electrolytic copper foil for wiring boards, the lightness index (L) is preferably 75 or smaller, and the total light reflectance (R) at the 600-nm wavelength is more preferably 10-55%. |
申请公布号 |
JP2016010961(A) |
申请公布日期 |
2016.01.21 |
申请号 |
JP20140146807 |
申请日期 |
2014.07.17 |
申请人 |
FURUKAWA ELECTRIC CO LTD:THE |
发明人 |
SHINOZAKI ATSUSHI;SAITO TAKAHIRO |
分类号 |
B32B15/08;H05K1/09;H05K3/06;H05K3/38 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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