Substrate, fabrication method of such a substrate, method of self-assembly of such substrates and device obtained thereof

摘要

A method of defining regions with different surface liquid tension properties on a substrate (101) is disclosed, said method comprising providing a substrate with a main surface having a first surface liquid tension property, the main surface being at least partially covered with a seed layer (103) and further comprising at least one micro-bump (105) formed on the seed layer, thereby leaving part of the seed layer exposed, patterning the exposed seed layer thereby exposing part of the main surface for forming at least one closed loop structure enclosing a region of the main surface; and chemically treating the main surface of the wafer thereby generating on the surface of at least one closed loop structure and at least one micro- bump a second surface liquid tension property, the second surface liquid tension property being substantially different from the first surface liquid tension property of the main surface.