| 摘要 |
PROBLEM TO BE SOLVED: To provide a powdery particulate resin composition for compression molding which is suitable for a compression molding method, is excellent in adhesiveness to a semiconductor element and is a sealing material having good moldability, and to provide a resin sealing type semiconductor device using the same.SOLUTION: There are provided a powdery particulate resin composition for compression molding which is a resin composition for sealing comprising (A) an epoxy resin, (B) a phenol curing agent, (C) a curing accelerator, (D) spherical silica and (E) a coumarone-based resin as essential components, wherein the (C) curing accelerator contains (c1) an imidazole-based curing accelerator and (c2) a phosphorus-based curing accelerator and 75 to 95 mass% of the (D) spherical silica is contained based on the total amount of the resin composition; and a resin sealing type semiconductor device obtained by sealing a semiconductor element using the resin composition. |
