CIRCUIT BOARD AND METHOD FOR PLACEMENT STATE TEST OF ELECTRONIC COMPONENT USING CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a circuit board and a method for a placement state test of an electronic component using a circuit board.SOLUTION: A method for a placement state test of an electronic component includes the steps of: providing a circuit board including a bonding pad 250 which includes a first pat 251 and a second pad 252 formed to be separated from the first pad 251 and on which an electronic component 300 is mounted; mounting the electronic component 300 on the bonding pad; and performing an electric test between the first pad 251 and the second pad 252 to test a placement state of the electronic component 300.