发明名称 SUSPENSION SUBSTRATE HAVING CIRCUIT AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a suspension substrate having a circuit capable of, when loading a slider onto a slider loading part interposing an adhesive agent, suppressing the excessive adhesive agent from protruding.SOLUTION: A suspension substrate 1 having a circuit includes: a metal support substrate 8; a base insulator layer 9 formed on the metal support substrate 8; and a conductor layer 10 formed on the base insulator layer 9. The metal support substrate 8 includes: a slider loading part 19 on which a slider 4 is loaded; and a pair of outrigger parts 16 arranged on both sides in width direction of the slider loading part 19 with an interval. The slider loading part 19 includes: an adhesive region 24 partitioned on an upper face of the slider loading part 19 and on which an adhesive agent 50 for loading the slider 4 is applied; and a receiving hole 25 arranged outside the adhesive region 24 and configured to receive the adhesive agent 50 protruding outside of the adhesive region 24.
申请公布号 JP2016009514(A) 申请公布日期 2016.01.18
申请号 JP20140131709 申请日期 2014.06.26
申请人 NITTO DENKO CORP 发明人 TANABE HIROYUKI;KANEZAKI SAORI;FUJIMURA HIROTO;TERADA NAOHIRO;SUGIMOTO YU;OKAMOTO NORIHIKO
分类号 G11B5/60;G11B21/21 主分类号 G11B5/60
代理机构 代理人
主权项
地址