发明名称 |
CHIP ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a chip electronic component having improved inductance and Q (quality factor) characteristics, and a method of manufacturing the same.SOLUTION: A chip electronic component includes a magnetic body 50 with internal coil parts 42, 44 buried therein. The magnetic body includes: a core layer 51 including the internal coil parts; and upper and lower cover layers 52, 53 disposed on upper and lower portions of the core layer. The core layer has a magnetic permeability different from that of at least one of the upper and lower cover layers. |
申请公布号 |
JP2016009858(A) |
申请公布日期 |
2016.01.18 |
申请号 |
JP20140177796 |
申请日期 |
2014.09.02 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO LTD |
发明人 |
PARK MOON SOO;KIM TAE-YON;LEE DONG HWAN |
分类号 |
H01F17/04;H01F17/00;H01F27/24;H01F27/255;H01F37/00;H01F41/04 |
主分类号 |
H01F17/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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