发明名称 CHIP ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a chip electronic component having improved inductance and Q (quality factor) characteristics, and a method of manufacturing the same.SOLUTION: A chip electronic component includes a magnetic body 50 with internal coil parts 42, 44 buried therein. The magnetic body includes: a core layer 51 including the internal coil parts; and upper and lower cover layers 52, 53 disposed on upper and lower portions of the core layer. The core layer has a magnetic permeability different from that of at least one of the upper and lower cover layers.
申请公布号 JP2016009858(A) 申请公布日期 2016.01.18
申请号 JP20140177796 申请日期 2014.09.02
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 PARK MOON SOO;KIM TAE-YON;LEE DONG HWAN
分类号 H01F17/04;H01F17/00;H01F27/24;H01F27/255;H01F37/00;H01F41/04 主分类号 H01F17/04
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