| 摘要 |
PROBLEM TO BE SOLVED: To suppress generation of swarf.SOLUTION: A surface crack FC is formed on the first principal surface S1 of a single crystal substrate 3. On the first principal surface S1 of a single crystal substrate 3, a glass layer 4 covering the surface crack FC is provided. A crack line CL is formed to extend on the surface SF of the glass layer 4. The process for forming the crack line CL includes a step for pushing a tip onto the surface SF of the glass layer 4, and a step for displacing the tip thus pushed on the surface SF of the glass layer 4. The single crystal substrate 3 is segmented along the crack line CL, by applying a stress to the single crystal substrate 3 provided with the glass layer 4. |
