| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a new pretreatment agent useful for forming a palladium or palladium alloy plating film having satisfactory deposition properties and excellent covering properties when electroless palladium plating or electroless palladium alloy plating is performed on an electroless nickel coating film and various metal materials such as a copper stock; and to provide an electroless palladium plating or electroless palladium alloy plating method using the pretreatment agent. <P>SOLUTION: An activation liquid for pretreatment of electroless palladium plating or electroless palladium alloy plating is made of an aqueous solution containing a reducing agent as an effective component. In the electroless palladium plating method or electroless palladium alloy plating method, electroless palladium plating or electroless palladium alloy plating is performed without performing water washing after bringing the activation liquid into contact with a workpiece. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
