发明名称 |
Light emitting diode package, light source module and backlight unit including the same |
摘要 |
A light emitting diode package, a light source module and a backlight unit including the same are provided. A plurality of light emitting diode packages are arranged on a printed circuit board without interference therebetween, by forming lines therein. |
申请公布号 |
US9236534(B2) |
申请公布日期 |
2016.01.12 |
申请号 |
US201414277237 |
申请日期 |
2014.05.14 |
申请人 |
LG Display Co., Ltd. |
发明人 |
Lee SeungJoon;Lee DongHun |
分类号 |
H01L33/48;H01L27/15;F21V8/00;H01L33/62 |
主分类号 |
H01L33/48 |
代理机构 |
Morgan, Lewis & Bockius LLP |
代理人 |
Morgan, Lewis & Bockius LLP |
主权项 |
1. A light emitting diode package, comprising:
a light emitting diode chip configured to generate light; a case configured to accommodate the light emitting diode chip therein; lead frames spaced apart from each other in the case, the lead frames including an anode lead and a cathode lead electrically connected to the light emitting diode chip; and a plurality of dummy lead frames spaced apart from the lead frames in an insulated state, the plurality of dummy lead frames being physically spaced apart from each other and electrically connected to each other in the case to form a line. |
地址 |
Seoul KR |