COMPONENT BUILT-IN MULTILAYER SUBSTRATE FABRICATING METHOD AND COMPONENT BUILT-IN MULTILAYER SUBSTRATE

摘要

A fabricating method according to the present disclosure is a component built-in multilayer substrate fabricating method for incorporating a component (12) in a resin multilayer substrate (11) formed by laminating and pressing thermoplastic resin sheets (111a to 111d) so as to crimp them to each other. With the fabricating method according to the present disclosure, a metal pattern (13) is provided on a component mounting surface of the thermoplastic resin sheet (111a). Further, the component (12) is inserted in the area sandwiched by the metal pattern (13). Out of widths relating to the area sandwiched by the metal pattern (13), the width in the component mounting surface side is assumed to be a width W2, and the width in the component-insertion side is assumed to be a width W3, the width W2 being equal to or larger than a width W1 of the component but less than the width W3.

主权项

1. A component built-in multilayer substrate fabricating method for incorporating a component in a resin multilayer substrate formed by laminating and pressing thermoplastic resin sheets so as to crimp them to each other, the method comprising the steps of:
providing a guide pattern on a component mounting surface of a first thermoplastic resin sheet which constitutes the thermoplastic resin sheets; and inserting the component in an area sandwiched by the guide pattern; wherein, out of widths relating the area sandwiched by the guide pattern, a width in the component mounting surface side is assumed to be a width W2, and a width in the component insertion side is assumed to be a width W3, the width W2 being equal to or larger than a width W1 of the component but less than the width W3.