Fan-Out Package and Methods of Forming Thereof

摘要

An embodiment is a package including a molding compound laterally encapsulating a chip with a contact pad. A first dielectric layer is formed overlying the molding compound and the chip and has a first opening exposing the contact pad. A first metallization layer is formed overlying the first dielectric layer, in which the first metallization layer fills the first opening. A second dielectric layer is formed overlying the first metallization layer and the first dielectric layer and has a second opening over the first opening. A second metallization layer is formed overlying the second dielectric layer and formed in the second opening.

主权项

1. A package comprising:
a chip comprising a substrate and a contact pad on the substrate; a molding compound laterally encapsulating the chip; a first dielectric layer overlying the molding compound and the chip and having a first opening exposing the contact pad; a first metallization layer overlying the first dielectric layer, wherein the first metallization layer fills the first opening and laterally extends over the molding compound; a second dielectric layer overlying the first metallization layer and the first dielectric layer and having a second opening over the first opening; and a second metallization layer overlying the second dielectric layer and electrically coupled to the first metallization layer through the second opening and laterally extends over the molding compound.