| 发明名称 |
SYSTEMS AND METHODS FOR CHEMICAL MECHANICAL PLANARIZATION WITH PHOTOLUMINESCENCE QUENCHING |
| 摘要 |
A method includes performing a chemical-mechanical planarization (CMP) on an article, providing a polishing fluid including luminescent particles capable of generating a fluorescent light in response to a light incident on the article, and detecting an intensity of the fluorescent light. An apparatus that is capable of performing the method and a system that includes the apparatus are also disclosed. |
| 申请公布号 |
US2016005667(A1) |
申请公布日期 |
2016.01.07 |
| 申请号 |
US201514855447 |
申请日期 |
2015.09.16 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company Limited |
发明人 |
LIU I-SHUO |
| 分类号 |
H01L21/66;B24B49/12;B24B37/013;H01L21/306;H01L21/67 |
主分类号 |
H01L21/66 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus configured to perform a chemical-mechanical planarization (CMP) on an article, comprising:
a polishing head configured to hold the article; and a fluorescence detector configured to detect an intensity of a fluorescent light generated in response to a light incident on the article. |
| 地址 |
Hsinchu TW |
