发明名称 |
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
A semiconductor package includes a package board that includes an circuit pattern and a plurality of contact pads electrically connected to the circuit pattern; a semiconductor chip having a plurality of chip pads; and a bump structure including a plurality of connecting bumps electrically connected with the semiconductor chip and the circuit pattern and a plurality of gap adjusting bumps bonded to the semiconductor chip and shaped into a slender bar between the semiconductor chip and the package board, the gap adjusting bumps spacing the semiconductor chip from the package board such that a gap space, S, is maintained between the package board and the semiconductor chip. A method of fabrication and a memory unit are disclosed. |
申请公布号 |
US2016005707(A1) |
申请公布日期 |
2016.01.07 |
申请号 |
US201514754686 |
申请日期 |
2015.06.29 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
KWON Yong-Hwan;PARK Myeong-Soon;LEE Chan-Ho |
分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor package comprising:
a package board comprising an circuit pattern and a plurality of contact pads electrically connected to the circuit pattern; a semiconductor chip having a plurality of chip pads; and a bump structure comprising a plurality of connecting bumps electrically connected with the semiconductor chip and the circuit pattern and a plurality of gap adjusting bumps bonded to the semiconductor chip and shaped into a slender bar between the semiconductor chip and the package board, the gap adjusting bumps spacing the semiconductor chip from the package board such that a gap space, S, is maintained between the package board and the semiconductor chip. |
地址 |
Suwon-si KR |