发明名称 配線構造および配線構造の製造方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring structure which uses two modes occurring in a wiring structure embedded between a first insulating layer and a second insulating layer and discharging from upper and lower corners of wiring as single mode, and has excellent dielectric breakdown resistance. <P>SOLUTION: A wiring structure comprises: a first insulating layer 2; wirings 4' and 4" provided on the first insulating layer 2 and having a copper wiring part 4a composed of copper or copper alloy; a dielectric layer 5 provided on the first insulating layer 2 and extending in a belt like shape along the wirings in a state in which the dielectric layer is in contact with one side surface of the wirings; and a second insulating layer 3 provided on the first insulating layer 2 and coating the wirings and the dielectric layer 5. The dielectric layer 5 has a relative permittivity higher than the first insulating layer 2 and the second insulating layer 3. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5838754(B2) 申请公布日期 2016.01.06
申请号 JP20110253344 申请日期 2011.11.18
申请人 富士通株式会社 发明人 須田 章一
分类号 H05K1/09;H05K3/42 主分类号 H05K1/09
代理机构 代理人
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